Avoiding inelastic strains in solder joint interconnections of IC devices / (Record no. 72673)
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| 000 -LEADER | |
|---|---|
| fixed length control field | 02572cam a2200529Ii 4500 |
| 001 - CONTROL NUMBER | |
| control field | 9780429460470 |
| 005 - DATE AND TIME OF LATEST TRANSACTION | |
| control field | 20220531132448.0 |
| 006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS | |
| fixed length control field | m o d |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION | |
| fixed length control field | 210113s2021 flua ob 001 0 eng d |
| 040 ## - Cataloging Source | |
| -- | OCoLC-P |
| -- | eng |
| -- | rda |
| -- | pn |
| -- | OCoLC-P |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780429460470 |
| -- | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0429460473 |
| -- | (electronic bk.) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780429863820 |
| -- | (electronic bk. : PDF) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0429863829 |
| -- | (electronic bk. : PDF) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780429863813 |
| -- | (electronic bk. : EPUB) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0429863810 |
| -- | (electronic bk. : EPUB) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 9780429863806 |
| -- | (electronic bk. : Mobipocket) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| International Standard Book Number | 0429863802 |
| -- | (electronic bk. : Mobipocket) |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER | |
| Canceled/invalid ISBN | 9780367635886 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC)1230505342 |
| 035 ## - SYSTEM CONTROL NUMBER | |
| System control number | (OCoLC-P)1230505342 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER | |
| Classification number | TK7874.53 |
| Item number | .S84 2021eb |
| 072 #7 - | |
| -- | TEC |
| -- | 008000 |
| -- | bisacsh |
| 072 #7 - | |
| -- | TEC |
| -- | 021000 |
| -- | bisacsh |
| 072 #7 - | |
| -- | TJFN |
| -- | bicssc |
| 082 04 - | |
| -- | 621.3815 |
| -- | 23 |
| 100 1# - MAIN ENTRY--PERSONAL NAME | |
| Personal name | Suhir, Ephraim, |
| Relator term | author. |
| 245 10 - TITLE STATEMENT | |
| Title | Avoiding inelastic strains in solder joint interconnections of IC devices / |
| Statement of responsibility, etc. | authored by: Ephraim Suhir. |
| 250 ## - EDITION STATEMENT | |
| Edition statement | First edition. |
| 264 #1 - | |
| -- | Boca Raton, FL : |
| -- | CRC Press, |
| -- | 2020. |
| 300 ## - PHYSICAL DESCRIPTION | |
| Extent | 1 online resource : |
| Other physical details | illustrations |
| 336 ## - | |
| -- | text |
| -- | txt |
| -- | rdacontent |
| 337 ## - | |
| -- | computer |
| -- | c |
| -- | rdamedia |
| 338 ## - | |
| -- | online resource |
| -- | cr |
| -- | rdacarrier |
| 520 ## - | |
| -- | "The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"-- |
| -- | Provided by publisher. |
| 588 ## - | |
| -- | OCLC-licensed vendor bibliographic record. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Interconnects (Integrated circuit technology) |
| General subdivision | Protection. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Solder and soldering |
| General subdivision | Mechanical properties |
| -- | Mathematical models. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Failure analysis (Engineering) |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | TECHNOLOGY / Electronics / General |
| Source of heading or term | bisacsh |
| 650 #7 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | TECHNOLOGY / Material Science |
| Source of heading or term | bisacsh |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM | |
| Topical term or geographic name as entry element | Electronic books. |
| 856 40 - | |
| -- | Taylor & Francis |
| -- | https://www.taylorfrancis.com/books/9780429460470 |
| 856 42 - | |
| -- | OCLC metadata license agreement |
| -- | http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf |
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