Suhir, Ephraim,

Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir. - First edition. - 1 online resource : illustrations

"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"--

9780429460470 0429460473 9780429863820 0429863829 9780429863813 0429863810 9780429863806 0429863802


Interconnects (Integrated circuit technology)--Protection.
Solder and soldering--Mechanical properties--Mathematical models.
Failure analysis (Engineering)
TECHNOLOGY / Electronics / General
TECHNOLOGY / Material Science
Electronic books.

TK7874.53 / .S84 2021eb

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