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1.
Avoiding inelastic strains in solder joint interconnections of IC devices / authored by: Ephraim Suhir.

by Suhir, Ephraim [author.].

Edition: First edition.Material type: Text Text; Format: available online remote; Literary form: Not fiction Publisher: Boca Raton, FL : CRC Press, 2020Online access: Taylor & Francis | OCLC metadata license agreement Availability: No items available :

2.
Human-in-the-Loop : Probabilistic Modeling of an Aerospace Mission Outcome / by Ephraim Suhir.

by Suhir, Ephraim [author.] | Taylor and Francis.

Edition: First edition.Material type: Text Text; Format: available online remote; Literary form: Not fiction Language: English Publisher: Boca Raton, FL : CRC Press, [2018]Copyright date: ©2020Online access: Click here to view. Availability: No items available :

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