Semiconductor devices in harsh conditions / edited by Kirsten Weide-Zaage, Malgorzata Chrzanowska-Jeske ; managing editor, Krzysztof Iniewski.
Material type:![Text](/opac-tmpl/lib/famfamfam/BK.png)
Contents:
section I. Radiation -- section II. Sensors and operating conditions -- section III. Packaging and system design.
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section I. Radiation -- section II. Sensors and operating conditions -- section III. Packaging and system design.