Thermal computations for electronics
conductive, radiative, and convective air cooling
Ellison, Gordon N.
creator
author.
text
bibliography
flu
2020
2020
Second edition.
monographic
eng
1 online resource (xxi, 382 pages) : illustrations
"The flavor and organization of the first edition has been retained whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first twenty percent of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems"--
Gordon N. Ellison.
Electronic apparatus and appliances
Thermal properties
Mathematical models
Electronic apparatus and appliances
Cooling
Mathematics
TECHNOLOGY / Construction / Heating, Ventilation & Air Conditioning
TECHNOLOGY / Electricity
TECHNOLOGY / Electronics / General
TK7870.25 .E43 2020eb
621.381/044
9781003029328
1003029329
9781000047387
1000047385
9781000047462
1000047466
9781000047424
1000047423
https://www.taylorfrancis.com/books/9781003029328
http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
https://www.taylorfrancis.com/books/9781003029328
http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
OCoLC-P
200103
20220531132621.0
9781003029328
eng