TY  - BOOK
AU  - Suhir,Ephraim
TI  - Avoiding inelastic strains in solder joint interconnections of IC devices
SN  - 9780429460470
AV  - TK7874.53 .S84 2021eb
U1  - 621.3815 23
PY  - 2020///
CY  - Boca Raton, FL
PB  - CRC Press
KW  - Interconnects (Integrated circuit technology)
KW  - Protection
KW  - Solder and soldering
KW  - Mechanical properties
KW  - Mathematical models
KW  - Failure analysis (Engineering)
KW  - TECHNOLOGY / Electronics / General
KW  - bisacsh
KW  - TECHNOLOGY / Material Science
KW  - Electronic books
N2  - "The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices"--
UR  - https://www.taylorfrancis.com/books/9780429460470
UR  - http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
ER  -